Exceptional Thermal Fatigue Resistance for Automotive Applications with ALPHA® HiTech® CU21-3240 Underfill. Using standalone SAC solder joints in BGA and CSP assemblies does not provide the level of thermal fatigue resistance required by automotive, aerospace, military and semiconductor manufacturers. To ensure that these assembled components are able to withstand long periods of exposure in harsh ...
This story continues at Sponsored Content – High Reliability Underfills for Automotive Applications
Or just read more coverage at Electronics Weekly
from News – Electronics Weekly https://ift.tt/313EJyF
via Yuichun
沒有留言:
張貼留言