CoolCube Circuit Stacking Moves to FinFET Process

The CEA-Leti research laboratory at Grenoble France, has reported that its CoolCube 3D interconnect technology is suitable for use with FinFET manufacturing processes as well as with fully-depleted silicon-on-insulator manufacturing processes.

from EETimes: http://ift.tt/1ORvAY8
via Yuichun