Today, at the Imec Technology Forum 2015 in Brussels, Imec announced that Toshiba, SanDisk and Imec have expanded their strategic partnership in advanced patterning.
This programme tackles the critical challenges that remain in bringing EUVL to high volume manufacturing.
The programme also develops other technologies for extending 193nm immersion lithography.
Toshiba and SanDisk have been core partners in Imec’s industrial affiliation programme in Advanced Memory since 2011.
IMEC’s Luc Van den Hove
“This expanded agreement with Toshiba and SanDisk represents the next step in our long-term strategic and fruitful partnership. We are proud to join forces and strengthen our collective research competence in advanced patterning,” says Imec CEO Luc Van den hove. “The agreement is a testament of the industrial value and impact our R&D programmes have on advanced semiconductor scaling. To date, this program, supported by our world-class infrastructure, represents the largest investment in advanced lithography equipment in the world.”
“Our participation in Imec’s advanced patterning programme provides us access to state-of-the-art lithography infrastructure for EUV technology R&D,” says SanDisk vice-president Ritu Shrivastava.
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