Micron’s 32-layer 3D NAND for production this year

Micron is to move into “low volume” production of a 32-layer 3D NAND device in the second half of this year.

Next year Micron says it expects 3D NAND to be a “significant” percentage of its “trade NAND supply”.

The device going into production this year will be a 32-layer device.

It is belived that 3D NAND does not become cost-competitive with the most advanced planar NAND until it reaches 48 layers.

So Micron will either have to sell them at a loss or charge more for them.

Nonetheless, CEO Mark Durcan says he expects the market to absorb all the 3D NAND he can make this year.

Production will be at the company’s Singapore fab.

Late next year Micron intends to introduce a “second generation” 3D NAND which is, presumably, a 48 layer device.

david manners

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via Yuichun