2015年6月29日 星期一

ASE to raise US$200 million through ECB

Advanced Semiconductor Engineering (ASE) has unveiled plans to raise US$200 million via an euro-convertible bond (ECB) issue, and set the conversion price of the ECBs at NT$54.55 (US$1.76).

from DIGITIMES: IT news from Asia http://ift.tt/1U2Ti8m
via Yuichun

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