IC backend set for tepid growth in 2H15, says ASE COO

The global IC packaging and testing industry has been working through excessive inventory for almost two quarters, but is set for tepid growth in the second half of the year, according to Tien Wu, COO for Advanced Semiconductor Engineering (ASE).

from DIGITIMES: IT news from Asia http://ift.tt/1CrRomU
via Yuichun