Advanced Semiconductor Engineering (ASE) has announced it will be showcasing system-in-package (SiP) solutions for consumer applications at the Computex Taipei 2015. These SiP applications will highlight the synergy between ASE's IC packaging, material and test technologies, together with the expertise of Universal Scientific Industrial Shanghai (USI) in module level manufacturing services to bring SiP into the realm of the Internet-of-Things (IoT), ASE said.
from DIGITIMES: IT news from Asia http://ift.tt/1csXE6S
via Yuichun
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