China-based foundry house XMC ties up with Spansion to develop 3D NAND flash chips

China-based 12-inch wafer foundry house XMC reportedly has teamed up with Spansion to jointly develop and produce 3D NAND flash chips, with trial production to begin in 2016 and volume production in 2017, according to industry sources.



from DIGITIMES: IT news from Asia http://ift.tt/1wX5ASQ

via Yuichun