Toshiba mosfet package improves cooling dynamics

Toshiba Electronics is now offering its ow-voltage mosfets in DSOP Advance packages which offer dual-sided cooling which it said will significantly improve heat dissipation.



The DSOP Advance package shares the same 5mm x 6mm footprint as a SOP Advance device.

In comparative tests operating temperatures – when used in conjunction with a suitable heatsink – for 30V mosfets were reduced by more than 34% at currents above 30A.

It is possible in some designs that the reduced thermal resistance of a DSOP Advance package may support elimination of a heatsink.

Toshiba will offer DSOP Advance packages with its existing UMOS VIII-H and its new UMOS IX-H families of mosfets. These technologies combine industry-leading on resistance (RDS(ON)) ratings with low output capacitance to deliver ultra-efficient switching performance. DSOP Advance options will be available for a number of mosfets with voltage ratings between 30V and 100V initially.

richard wilson

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via Yuichun