Imagine a world without dependable global navigation satellite systems (GNSS). Air and sea transportation would stop, and militaries would be blinded.
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Imagine a world without dependable global navigation satellite systems (GNSS). Air and sea transportation would stop, and militaries would be blinded.
Northrop Grumman is claiming a speed record with “the fastest solid-state amplifier integrated circuit ever measured”.
Developed for US military lab DARPA, the ten-stage common-source amplifier showed 10dB gain at 1.0THz and 9dB at 1.03THz. The transistors are 25nm gate length indium phosphide (InP) HEMTs.
“Gains of six dB or more start to move this research from the laboratory bench to practical applications—nine decibels of gain is unheard of at terahertz frequencies” said DARPA programme manager Dev Palmer, “This opens up new possibilities for building terahertz radio circuits.”
Palmer envisages high-resolution security imaging systems, collision-avoidance radar, comms networks and chemical spectrometers using the technology.
DARPA has several THz programmes including ‘High frequency integrated vacuum electronics’ (HiFIVE), ‘Sub-millimeter wave imaging focal plane technology’ (SWIFT) and ‘Technology for frequency-agile digitally synthesised transmitters’ (TFAST), each building on the previous one.
Under DARPA programmes, Northrop demonstrated an 850GHz receiver in 2012, and 670GHz in 2010.
Northrop also showed THz operation in vacuum devices, when it revealed a micromachined 850GHz travelling wave tube last year. “DARPA-sponsored research has taken tools developed by the semiconductor and MEMS revolution and applied them to vacuum tube technologies,” said Palmer at the time.
“A decade ago, there was no consensus in the scientific community whether an integrated circuit operating at 1THz was technologically possible,” said Northrop THz programme manager William Deal. “An interdisciplinary team of scientists and engineers worked together in scaling all facets of our MMIC technology to enable the 1THz result. Now, as a result of DARPA’s investment in high-speed transistor processes, it will become routine to fabricate wafers containing thousands of THz integrated circuits.”
DARPA has plans to put the travelling wave tube in its ‘video synthetic aperture radar’ (ViSAR) – an attempt to create a TV-like 2d imager that can see through clouds using high frequency radio waves.
The O-S-D (opto, sensors, discretes) sector will grow 9% this year after 1% growth in 2012 and 2013, reports IC Insights. This year sales should reach a record $68.9 billion.
The CAGR between 2013 and 2018 is projected at 6.8% with the market reaching $81.5 billion in 2017, a bit better than the 6.4% CAGR recorded for O-S-D sales in the past five years (2008-2013).
Optoelectronics is expected to continue to be the most consistent growth segment in the O-S-D marketplace during the next several years, primarily do to strong demand for CMOS image sensors in a wide range of embedded applications (such as image recognition, medical, video-surveillance networks, and automotive systems) and climbing sales of laser transmitters for high-speed optical communication networks.
However, optoelectronics growth has been dampened in recent years by price erosion in lamp devices due to the build up of worldwide capacity for high-brightness LEDs, which are becoming cheaper for solid-state lighting applications in homes, businesses, outdoors, and automobiles.
The other two O-S-D segments – sensor/actuator products and discrete semiconductors – are climbing out of their two-year slump.
During the past several years, sensors and actuators have been the fastest growing semiconductor market segment but double-digit percentage sales increases in this category came to a screeching halt in 2012 when high-flying demand for acceleration and yaw-rate sensors slowed and average selling prices (ASPs) fell by 10%.
Accelerometers and gyroscopes (movement-measuring devices) are expected to remain the largest sensor product category through 2018 but faster-growing pressure and magnetic-field sensors are forecast to gain marketshare over the next four years.
Analog Devices is aiming at low-power signal measurement with a combined synchronous demodulator and filter chip which allows precision magnitude and phase measurements to be made on analogue signals buried in noise.
Called ADA2200, the IC has a digitally-controlled switched-capacitor analogue signal chain, which the firm describes as ‘sampled analogue technology’ (SAT), that Analog acquired when it bought Lyric Semiconductor.
“By processing the signal entirely in the analogue domain, this analogue-in, sampled-analogue-out device reduces A/D converter sample rates, lowering A/D converter power consumption and off-loading computationally heavy tasks from the digital processor or microcontroller,” claimed Analog.
Consumption is 390uA from 3.3V (clocking at 500kHz), suiting the device to battery power. The firm see it being used for impedance measurement, gas detection, air analysis, fluid analysis, strain gauges and proximity measurement; in medical, industrial and communications markets.
Inside (see diagram) it includes a low-pass FIR (finite impulse response) filter, 1/8x decimation filter, configurable IIR (infinite impulse response) filter, a mixer with 0°/90° phase selection, reference clock and A/D converter driver output.
Optimised for input sampling rates up to 1MHz, it can demodulation input bandwidths to 30kHz with 0.009° phase detection sensitivity. Operation is from -40 to +85°C.
Synchronous detection (see diagram) is suite to sensors that have a small output in noisy environments.
Rather than stimulate the sensor with a dc voltage, it is energised by an ac reference signal. Then at the measuring end, that same ac signal is multiplied by the received sensor output. This multiplied output is the desired sensor output at DC (0Hz), plus a bunch of higher frequency rubbish that can be filtered off.
A modification in the case of the ADA2200 is that it has a divide-by-eight ‘decimation’ filter, which reduces the sampling rate needed in a subsequent ADC.
Dividers in the chip provide the ac reference signal from a master clock. In a typical application, said Analog, an 80kHz master results in the chip generating a 1.25kHz reference clock for the sensor. 80kHz clocks the input low-pass filter, and results in a sample rate of 10kHz after the decimation filter. 1.25kHz, locked to the 80kHz, is also the centre frequency of the on-chip IIR filter in its default band-pass configuration.
0 and 90degree options are available at the multiplier input to allow for phase-shifts in external circuits as synchronous detection will not work if there is exactly 90°between the reference and sensor output signals.
As the output of a synchronous detector is dependent on both the amplitude of the input and the relative phases of the reference and received signal, the chip can be used as a phase detector if the input amplitude is kept constant.
By measuring the chip output in both 0 and 90° modes, and squaring those to readings, the phase is proportional to the square root of the sum of the squares.
The 90°phase shift also enables a pair of ADA2200devices to perform in-phase and quadrature demodulation.
The output can either be read by an ADC, or used as an analogue waveform via a low-pass reconstruction filter.
When the demodulation function is disabled, the signal chain acts as a precision filter with a programmable bandwidth and tunable centre frequency. “The filter characteristics are highly stable over temperature, supply, and process variation,” said Analog.
Internal registers are programmed over an serial port, or the chip can boot itself from a serial EEPROM.
In this tutorial Dave explains what a PCB spark gap is and how it can be a useful zero cost addition to your PCB layout to help prevent ESD damage.
He shows how to easily design them into your board and calculate the approximate voltage rating.
And of course has some fun applying 5kV to some gaps to show how them at work.
Plugpack teardown
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Auditing firm KPMG warned of smart meter security risks at the Westminster Energy, Environment and Transport Forum.
Its cyber security specialist Alejandro Rivas-Vásquez was discussing UK’s smart meter implementation programme in the light of flaws found during the equivalent Spanish programme.
“Spanish researchers recently found fundamental security flaws in the design of smart metering devices deployed across the Channel,” he said. “Arguably, these flaws should have been identified by the Spanish deployment team, long before the meters were fitted in households. In the UK, whilst CESG has issued security specifications for smart metering vendors to prevent this type of issue, a need for overseeing compliance should not be underestimated by Ofgem and DECC.”
CESG is the UK government’s national technical authority for information assurance.
He went on to say: “Not long ago, we saw similar technologies being hacked for fraudulent activities here in the UK, when prepaid metering top-up keys with false credit information were cloned and sold to customers. The Spanish research shows smart meters could be hacked to under-report consumption and this should act as warning to the GB programme.”
If the technology could be hacked for fraud, hackers with more nefarious intent may use these flaws for other purposes, and Rivas-Vásquez pointed out that smart meters will be at the heart of critical national infrastructure, and that any interconnected system is only as strong as its weakest link. “That’s why in the UK, the Smart Energy Code makes specific arrangements for independent security and privacy assurance activities to take place, within each of the parties of the programme,” he said.
KPMG advice to government:
“Cyber criminals and cyber terrorists are improving their capabilities very quickly,” said Rivas-Vásquez.
Toshiba Electronics is now offering its ow-voltage mosfets in DSOP Advance packages which offer dual-sided cooling which it said will significantly improve heat dissipation.
The DSOP Advance package shares the same 5mm x 6mm footprint as a SOP Advance device.
In comparative tests operating temperatures – when used in conjunction with a suitable heatsink – for 30V mosfets were reduced by more than 34% at currents above 30A.
It is possible in some designs that the reduced thermal resistance of a DSOP Advance package may support elimination of a heatsink.
Toshiba will offer DSOP Advance packages with its existing UMOS VIII-H and its new UMOS IX-H families of mosfets. These technologies combine industry-leading on resistance (RDS(ON)) ratings with low output capacitance to deliver ultra-efficient switching performance. DSOP Advance options will be available for a number of mosfets with voltage ratings between 30V and 100V initially.
Huber+Suhner has a range of dual-band UHF RFID antennas designed for integrated RFID devices.
The Sencity SPOT-L antennas support both European ETSI UHF (865 – 868MHz) and USA/Canadian FCC UHF (902 – 928MHz) RFID bands.
The antennas have a low profile of 11.5 – 15mm, and as a result likely applications may include use as a conveyor portal antenna or as an under-belt antenna in RFID system applications including warehousing, industrial automation, distribution, retailing and logistics.
There are two flat panel antennas in the range which can be placed on the conveyor sides or as a gate. Model 1309.19.0002 measures 773 x 312 x 15mm while 1309.19.0003 measures 480 x 312 x 15mm. The under-belt flat panel antenna, Model 1309.17.0110, measures 1020 x 380 x 11.5mm and can be mounted directly under moving belts.
All three models are left hand circular polarized, DC grounded and come with a cable pigtail. Other key features of interest to system designers include an operating temperature range of -30⁰C to +50⁰C, ingress protection to IP54 and shock and vibration resistance to IEC 60721-3-4.
ST’s Q3 revenues of $1.89 billion were 6.3% down on Q3 2013 and will fall another 3.5% in Q4 forecast the company.
The company made a $72 million profit in the quarter thanks mainly to a tax benefit worth $42 million.
ST said it would implement $100 million in annualised savings at its loss-making digital business and is “reviewing the implications to our process technology following the recent announcements by our research alliance partners”.
This could refer to the announcements by IBM, which supplies ST with its basic process technology, to get out of microelectronics and sell its factories to Globalfoundries.
Following its June sale of bonds worth $1 billion ST has now got $2.4 billion of cash and $1.97 billion of debt.
Shares have fallen 11% this year and ST’s market cap is now €4.7 billion.
Kilopass Technology says it has ported its antifuse OTP embedded NVM technology to TSMC’s 16nm finfet process.
“Embedded non-volatile memories are becoming an increasingly important part of SoC designs,” says TSMC’s Suk Lee. “Kilopass’ support for this technology at the 16nm finfet node enables us to offer our mutual customers a complete solution that saves design time, chip area and power consumption.”
Kilopass’ OTP 2T bit cell technology works on a variety of processes including low power, high-voltage, and high-K metal gate.
The Kilopass IP is foundry agnostic and is used by SMIC, Global Foundries, IBM, Samsung, UMC, Dongbu HiTek, Tower and Grace as well as TSMC.
MegaChips of Osaka, the 24-year-old IC design house, is to buy Bosch-backed SiTime of Sunnyvale, the MEMS timing specialist, for $200 million in cash.
The companies say they are complementary in that they both address the wearables, mobile and internet of things (IoT) markets.
“MegaChips has an aggressive growth strategy with a vision to become one of the top ten fabless semiconductor companies through both organic growth and strategic acquisitions,” said Akira Takata, CEO of MegaChips.
“MEMS components are fuelling the growth of the semiconductor industry. Through the acquisition of SiTime, MegaChips becomes a leader in MEMS. SiTime will help us expand our portfolio and diversify our customer base,” said Takata.
“SiTime technology is the perfect match for MegaChips’ solutions that target wearables, mobile and IoT markets such as ‘Frizz’, our ultra-low-power smart phone Sensor Hub LSI and BlueChip Wireless, a sub-GHz RF LSI,” he added.
MegaChips has revenues of over $600 million and its expansive strategy saw it buying Kawasaki Microelectronics in 2012.
Symtavision, the timing analysis specialist for verifying embedded systems, has developed an integrated, model- and trace-based methodology for Renesas RH850 multi-core MCUs.
The Symtavision/Renesas approach uses Symtavision’s SymTA/S tool suite for model-based timing analysis, optimisation and synthesis, and Symtavision’s powerful TraceAnalyzer for visualising and analysing timing from measurements and simulations.
Both SymTA/S and TraceAnalyzer are used by the automotive industry for developing ECUs, networks and distributed systems.
The methodology involves target tracing to gather fundamental timing data in a realistic environment on the target platform (or one that is predictably related).
Tracing tools from Green Hills Software, Gliwa, iSYSTEM or Lauterbach can be used.
Symtavision’s TraceAnalyzer then processes this data to visualise and validate the internal scheduling of the device and derive metrics such as memory access times, runnable execution times and patterns of sporadic interrupts
This creates RH850 virtual performance models in SymTA/S which allow an early assessment of design alternatives to ensure that all software can execute in real-time and can provide a basis for the continuous validation of model assumptions versus actual implementation.
The RH850 models ensure that key multicore-related design challenges such as optimal software and task partitioning, as well as data allocation and arbitration, are systematically addressed.
The models can be extended seamlessly to analysis of distributed functions over CAN, Ethernet, FlexRay or LIN.
Mailbag Monday
Dave opens his mail.
Spoilers & Links:
iPod Blood pressure monitor
Old computer hardware
Intel 1Mb Bubble Memory
PICop development board
TEM Products SMD IC and LED thermal products
PowerPeg
Stepper Motor Controller
TSL1401CL LineScan Camera
Forum HERE
Materials firm Corning has joined Maxwell Technologies to develop better supercapacitors, also known as ultracapacitors, for cars.
Corning brings expertise in materials and analytical capabilities, according to Maxwell.
“Corning has invested significant time and resources to establish this new business initiative because we see great potential in capacitive energy storage. We are excited to work with a company like Maxwell who has such a long history of innovation in the field and strong market presence,” said Corning director of automotive innovations Doug Harshbarger.
Supercapacitors are often promoted as a partner to batteries in automotive traction applications. While they have far lower energy density (Wh/litre or Wh/kg) than electrochemical batteries, they can accept and deliver energy far faster (W/litre and W/kg) making them suitable for load levelling in, for example, regenerative breaking and acceleration. They also work over a wider temperature range: -40 to +65°C, according to Maxwell, and have a far longer cycle life – a million or more charge/discharge cycles. Energy storage alongside electrically-coupled turbo chargers is another potential application.
The firm points out that there are over 1 million Peugeot Citroen cars on the road incorpotating its supercapacitors, in a voltage stabilisation system developed by Continental.
However, improvements to batteries tend to offset the need to add supercapacitors to batteries.
Maxwell offers components from 1 to 3,400F, and modules from 12 to 160V.
Renesas Electronics has introduced a reference design for a smart meter, which incorporates metrology and calibration routines, required for a billing polyphase meter design.
The hardware platform is based on the firm’s RX21A microcontroller with a metrology front end circuit and the application processor in a single chip. The RX21A MCUs incorporate three, four or seven independent 24-bit delta-sigma analogue-digital converters (ΔΣ-ADC).
Designed to accommodate single-phase, split-phase and three-phase plus neutral billing electricity meters respectively, the ΔΣ-ADC channels include a programmable gain amplifier (PGA), which allows the target meter to cover a dynamic range between 10mA and 100A at enhanced temperature range.
By storing calibration data in the flash, the RX21A devices cover applications better than Class 0.2S, thus exceeding the most stringent IEC metering requirement presently available, the IEC62053-22.
Called “Bill It!” Smart Meter RX21A, the design is built and supported entirely in Europe, and fulfils all required Cenelec standards for EMC and safety.
The design includes an intuitive PC graphical user interface (GUI), providing engineers during the design phase with all the information they need to trim and analyse the data measured by the ΔΣ-ADC channels. This covers both graphical feedback from the ADC data as well as prepared data after the calibration steps, frequency analysis and separation of active/reactive energy use.
Each kit contains the Bill It! Polyphase Meter, a CD-ROM including the embedded metrology and calibration software source code, the PC GUI, the board schematics, the bill of materials, Gerber files, user manual, quick start guide and the electrical connection setup needed to use the electricity meter.
The availability of the new RX21A kit implements the next step in Renesas strategy of being a solution provider. It does this by providing all the required components, comprising both hardware and software, to enable designers and engineers to re-use proven solutions for their target application, reduce costs and accelerate their time to market. Renesas will be launching additional kits over the coming months to continue the implementation of this strategy.
The new “Bill It!” solution kit will to be launched by Renesas at Electronica 2014 in November (Hall A6, Stand 243).
Graphene Flagship, the €1 billion EC-funded FET (Future and Emerging Technologies) project which aims to take graphene-based products from lab to market, has recruited its first four associate members: Netzsch (Germany), NetComposites (UK), ABB and Imerys (Switzerland).
Graphene Flagship has 142 partners in 23 countries. ‘Associate’ partners are a new class of member.
The first four associates are:
• ABB – the power and automation company
• NetComposites – a global research, consultancy and online media company focusing on the composite materials industry
• Imerys Graphite & Carbon – previously TimCal, which supplies graphite for energy storage, engineering materials and conductive polymers
• Netzsch– an industrial tool supplier specialising in mechanical grinding, milling, dispersion and de-aeration.
The Graphene Flagship is partnering with the EU-funded PolyGraph project, which oversees the development of graphene production processes within thermosetting polymer resins.
NetComposites, Imerys and Netzsch are affiliates of PolyGraph.
The first four associated members of the Graphene Flagship are the first of many envisaged. New associates are expected to join every few months.
Worldwide semiconductor capital spending is projected to total $64.5 billion in 2014, an increase of 11.4% from 2013 spending of $57.8 billion, according to Gartner, and will grow another 8.8% to top $70 billion next year.
Capital equipment spending will increase 17.1% in 2014, driven by strong average selling prices (ASPs) and increased demand for consumer products.
“While capital spending outperformed equipment spending in 2013, the reverse will hold true for 2014,” says Gartner’s David Christensen, “capital spending will grow 11.4% in 2014 – result of Samsung increasing its announced spending plans to $14 billion. Equipment spending will increase 17.1%, as manufacturers pull back on new fab construction and concentrate on ramping up new capacity instead.”
In recent years, the equipment industry has consolidated, as major vendors have acquired complementary and competitive companies. As equipment advancements lead to higher development costs, the trend is expected to continue.
Foundries will continue to outspend the logic IDMs in 2014. Foundry spending is expected to increase by 4.5% in contrast with the 0.3% decrease in total logic spending. However, the longer-term outlook for total foundry spending shows a flat profile, as predicted mobility market saturation will dampen the need for new foundry capacity and creates an environment where existing capacity is upgraded to the latest node.
The memory capex outlook remains strong for 2014 with a 40% increase anticipated in the current forecast, compared with a 25% increase in the previous quarter’s forecast. Memory manufacturers are currently enjoying a strong pricing environment, which sets the stage for renewed spending growth.
The current DRAM undersupply will continue through 2015, moving back into an oversupply in 2016 as new wafer capacity is added to the market.
Samsung has announced that it will be using one floor of its newly completed S3 fab in Suwon, South Korea, for DRAM production.
In late December 2013, Hynix announced that it would invest $1.7 billion at its Icheon, South Korea, complex to build a new fab shell and clean room.
This means both Korean vendors are bringing on new DRAM wafer capacity, pushing bit supply growth to 36% in 2016.
This combined with the mild demand growth in the same period moves the market into oversupply.
FTDI have released a windows driver update that bricks any product using counterfeit chips.
A classic case of corporate suicide.
Dave breaks down “FTDIgate”, and rants about FTDI’s official response.
NOTE: The 2nd half of this video includes the original rant video before FTDI responded and withdrew their new driver.
FTDI’s response
The forum thread that’s going crazy!
Microchip has introduced a general-purpose fast parallel flash memory chip.
SST38VF6401B is a 4M x16 CMOS with a split-gate cell design and thick-oxide tunneling injector for better reliability and manufacturability.
Operating is from 2.7 to 3.6V and the memory is partitioned into uniform 32kword and non-uniform 8kword blocks.
Various levels of protection are provided, including Security-ID, hardware boot-block protection, individual block protection, password protection, and irreversible block locking.
This device conforms to JEDEC standard pin assignments for x16 memories and comes in 48pin TSSOP and 48ball TFBGA.
Applications are expected in consumer, automotive and industrial markets, for example: set-top boxes, multi-function printers, digital TVs, audio, video and car infotainment.
At a glance