TSMC reportedly to tie up with Micron to develop 3D ICs

Taiwan Semiconductor Manufacturing Company (TSMC) reportedly plans to team up with Micron Technology to develop 3D ICs that will integrate Micron's hybrid memory cube-based DRAM chips with TSMC's logic chips through TSV technology, according to industry sources.



from DIGITIMES: IT news from Asia http://ift.tt/1hYqSHl

via Yuichun