Trends in mobile computing technologies and component packaging

2.5D interposer packaging technologies are being used in products ranging from Intel's Haswell/Broadwell processors to AMD's mobile high-performance GPU chips. DDR4, which is about to be introduced into the mainstream, is also likely to incorporate 3D Stacks+TSV packaging; mobile communications require integration of RF ICs, MEMS sensors, and PA ICs, and heterogeneous 3D ICs will provide this type of integration, ushering in dramatic advancements in terms of functionality in these ever smaller and ever lighter mobile devices.



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via Yuichun