Saki has upgraded its automated 3D x-ray inspection system (3D-AXI). “The 3Xi-M110 V3 model delivers cycle times of more than twice as fast as previously possible and the accuracy provided is unparalleled,” claimed the company. “The system utilizes volumetric inspection to identify voids in multi-layer solder, THT assembly and BGA head-in-pillow issues, and defective component ...
The post Tokyo Nepcon: In-line automated 3D x-ray inspection for production appeared first on Electronics Weekly.
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