Canon has brought out a back-end process semiconductor lithography i-line stepper system for 3D packaging technologies with a 0.8 µm resolution and an exposure field of 100 mm x 100 mm. The FPA-5520iV LF2 Option Exposure of single large-size wafer is done through 4 shots (4 shots x 4 times) The FPA-5520iV LF2 Option reduces ...
The post Canon launches back-end i-line stepper for 3D packaging appeared first on Electronics Weekly.
from News | Electronics Weekly https://ift.tt/WoDVeAJ
via Yuichun
沒有留言:
張貼留言