Henkel and Chip Integration Technology Center (CITC) have agreed to collaborate on the development of high-thermal die attach solutions for RF and power electronics. Under the terms of the partnership, Henkel will supply commercialised and developmental pressureless sintering die attach formulations and CITC will provide testing and analysis of the materials within next- generation package ...
The post Henkel and CITC to co-develop high-thermal die attach appeared first on Electronics Weekly.
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