Imec has presented an experimental study of Al-based binary compounds, with focus on their resistivity behavior. For example, for stoichiometric AlCu and Al2Cu films, a resistivity as low as 9.5µΩcm was reported. These results experimentally support their promise to be used as new conductors in advanced semi-damascene interconnect integration schemes, where they can be combined ...
This story continues at Intermetallics and airgaps for 1nm nodes and beyond
Or just read more coverage at Electronics Weekly
from News – Electronics Weekly https://ift.tt/3dS5KZn
via Yuichun
沒有留言:
張貼留言