Advanced packaging market growing 6.6% CAGR to reach $42bn in 2025

The advanced packaging market is expected to grow at 6.6% CAGR 2019-2025, reaching $42 billion in 2025, forecasts Yole Developpement. By technology platform: the highest revenue CAGR is expected from 2.5D / 3D stacking IC , embedded die, and fan-out representing 21%, 18% and 16% of the total market, respectively. TSMC, Intel, Samsung, Amkor, ASE ...

This story continues at Advanced packaging market growing 6.6% CAGR to reach $42bn in 2025

Or just read more coverage at Electronics Weekly

from News – Electronics Weekly https://ift.tt/3bLA0U5
via Yuichun