SPIL looks to effective results of SiP packaging development with Foxconn

Siliconware Precision Industries (SPIL) expects its strategic partnership with Foxconn Electronics for developing SiP (system-in-package) packaging technology to begin bearing fruit within one year, according to company chairman Bough Lin.

from DIGITIMES: IT news from Asia http://ift.tt/1FiEqt8
via Yuichun