French research fab CEA-Leti has manufactured accelerometers on 300mm wafers, thought to be a first for the MEMS industry.
“This demonstration that our 200mm MEMS platform is now compatible with 300mm wafer fabrication shows a significant opportunity to cut MEMS production costs,” said Leti CEO Marie Semeria. “This will be especially important with the expansion of the Internet of things and growing demand for MEMS in mobile devices.”
This is Leti’s ‘M&NEMS’ technology, based on detection by piezo-resistive silicon nanowires, which is claimed to reduce the size of multi-axis sensors. It also allows fabrication of combo sensors – for example three-axis accelerometer plus three-axis gyroscope plus three-axis magnetometers on the same chip. It is currently being transferred to “an industrial partner”, said the lab.
In addition: “manufacturing MEMS with 300mm technology enables 3D integration using MEMS CMOS processes in more advanced nodes than on 200mm, and the use of 3D through-silicon-vias, which is already available in 300mm.”
Details are being presented at the European MEMS Summit this week.
from News http://ift.tt/1OCeHTH
via Yuichun
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