The initial reluctance of mobile firms to adopt NFC for contactless transactions seems to have evaporated. And this Qualcomm partnership indicates the growing interest of the mobile sector in the ten-year old contactless technology.
Qualcomm will integrate NXP’s NFC and embedded secure element (eSE) IP in its Snapdragon 800, 600, 400 and 200 processor based platforms.
Qualcomm will create reference designs to expand the reach of NFC beyond the smartphone and into other applications such as home automation, consumer electronics, automotive, smart appliances, personal computing and wearables.
“NXP’s NFC and eSE chipsets are a natural addition to Qualcomm Technologies’ platforms, given NXP’s expertise in enabling secure transactions,” said Dr. Cormac Conroy, vice president, Qualcomm Technologies.
The NQ220 module, which was derived from the recently launched NXP PN66T module, is intended to simplify the process of deploying credentials to devices, significantly reducing design costs and time-to-market considerations for mobile wallets and additional applications such as prepaid payment, transit and access control.
“We continue to see the market use and acceptance of NFC grow daily, with new applications being created at an astounding rate. Collaborating with Qualcomm Technologies to provide full eSE and NFC functionality on its industry-leading platforms will further expand this growth potential,” said Rafael Sotomayor, senior vice president, NXP Semiconductors.
IHS has predicted that in 2018 1.2 billion mobile phones will be sold and NFC could be used in 64% of them.
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