CMOS image sensors are on the bleeding edge of 3-D chip stacking, so much so that the CMOS imaging may make 3-D TSV obsolete - before the processor and memory industry widely adopts it.
from EETimes: http://ift.tt/1J1qrhP
via Yuichun
from EETimes: http://ift.tt/1J1qrhP
via Yuichun
沒有留言:
張貼留言