Taiwan-based IC substrate makers Unimicron Technology, Kinsus Interconnect Technology and Nanya PCB will continue to ramp up their production capacities for flip-chip chip scale package (FC CSP) substrates in 2015, according to industry observers.
from DIGITIMES: IT news from Asia http://ift.tt/1HDniR0
via Yuichun
from DIGITIMES: IT news from Asia http://ift.tt/1HDniR0
via Yuichun
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