Siliconware Precision Industries' (SPIL) fan-out type wafer level packaging (WLP) will be ready for mass production in 2016, company chairman Bough Lin said during a January 28 investors conference.
from DIGITIMES: IT news from Asia http://ift.tt/1zbQoF5
via Yuichun
from DIGITIMES: IT news from Asia http://ift.tt/1zbQoF5
via Yuichun
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