While Taiwan-based cooling module makers have been developing 0.6-0.8mm ultra-thin heat-pipes for smartphones, China-based makers have brought continued competitive pressure through upgrading technology and are expected to surpass Taiwan makers in two years, according to sources from cooling module makers.
from DIGITIMES: IT news from Asia http://ift.tt/RgAXYU
via Yuichun
from DIGITIMES: IT news from Asia http://ift.tt/RgAXYU
via Yuichun
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