STATS ChipPAC fcCuBE technology achieves significant growth in 2013

STATS ChipPAC has announced that unit shipments of semiconductor packages utilising its patented fcCuBE technology more than quadrupled in 2013 compared to 2012. The performance and cost advantages of this advanced flip-chip packaging technology has driven adoption by customers in the mobile, consumer and cloud computing markets.

from DIGITIMES: IT news from Asia http://ift.tt/N0Zhwp

via Yuichun