2021年6月30日 星期三

Boron arsenide spreads heat better than diamond

UCLA engineers have monolithically integrated a boron arsenide heat spreader into a GaN HEMT logic chip to improve cooling. At the same time they built similar chips with diamond and silicon carbide heat spreaders. The diamond and SiC circuits had hotspots at around 137°C and 167°C respectively, according to the university, while those in the BAs-cooled ...

This story continues at Boron arsenide spreads heat better than diamond

Or just read more coverage at Electronics Weekly



from News – Electronics Weekly https://ift.tt/3AehCyE
via Yuichun

沒有留言:

張貼留言