Wafer foundry houses in China have stepped up efforts to develop Fully Depleted Silicon-on-Insulator (FD-SOI), or also called Ultra-Thin Body (UTB), processes for wafer production, compared to the Fin Field-Effect Transistor (FinFET) processes being adopted by Taiwan Semiconductor Manufacturing Company (TSMC) and Intel, according to Digitimes Research.
from DIGITIMES: IT news from Asia http://ift.tt/1XDd77h
via Yuichun
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