Dielectric layers are essential to separate electrical conductors but, with a few notable exceptions – diamond for example – introduce thermal barriers.
Spreading heat before it reaches insulating layers – with thick copper for example – increases heat flow through subsequent insulating layers.
Adding a vertical dielectric layer allows thick copper tracks to get right up to the metal contacts on the LED package.
The technique “has significant benefits for flip-chip packaging where dielectric layers are usually very close to the diode”, said Litecool. “Vertical dielectric technology allows for close packaging of multiple LEDs within one package with minimal effect on thermal performance as well as significant reductions in the thermal resistance of flip-chip packages.” patents is pending.
Dielectrics no longer to be selected for reduced thermal resistance – usually ceramics are selected. “Cheaper polymer based dielectrics can be used as their thermal impact is negated,” said Litecool, whose new packages are designed to be made in high volume.
“It is not a difficult concept to design but it is difficult to manufacture. We have had to develop new manufacturing processes to allow for the track and gap ratios required, and it has resulted in performance way beyond anything else on the market,” said Litecool project engineer Robert Corbin.
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