ITF2015: Affordable scaling is the key, says ASML

Affordable scaling is the key to the semiconductor industry, it was said at the Imec Technology Forum in Brussels.

“If we are not getting scaling affordable there are trillions at stake,” ASML CEO Peter Wennink told the forum, adding that he is an accountant not a technologist so he understands about costs.

Affordable scaling depends on getting EUV (extreme ultraviolet lithography) into the manufacturing process at the 7nm node and on a successful
mix-and-match approach with immersion, said Wennink.

Double patterning will get the industry to 10nm but then it needs either multi-patterning or techniques like directed self assembly, Imec’s process senior vice-president An Steegen told the forum.

“At 10nm multi- patterning means exploding complexity, ” said Wennink.

EUV solves that problem, but it is not there yet. The light source which ASML uses from its San Diego subsidiary Cymer is currently 80W, and ASML has demonstrated 110W, but some people are saying 350W is needed.

Wennink said two years of “solid progress” had debunked scepticism about the viability of getting a sufficiently powerful light source.

Up-time for EUV steppers needs improving, he said. Currently it averages 55% and one customer has achieved 86% during one week. Wennink said ASML’s target is to reach 86% average by the end of 2015.

david manners

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