Researchers are finding all kinds or novel cooling methods to pull out the heat threatening to melt down chips that run faster than 3-Gz, but by embedding thermoelectric nanowires into the backside of chip Sandia National Labs hopes to continue scaling to higher speeds.
from EETimes: http://ift.tt/1ESjVHb
via Yuichun
from EETimes: http://ift.tt/1ESjVHb
via Yuichun
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