Samsung mass producing high-density ePoP memory for Smartphones

Samsung Electronics has announced that the company is mass producing ePoP (embedded package on package) memory, a single memory package consisting of 3GB LPDDR3 DRAM, 32GB eMMC and a controller. For use in high-end smartphones, the extremely-thin ePoP combines all essential memory components into a single package that can be stacked directly on top of the mobile processor, without taking any additional space, a distinct improvement over existing two-package eMCP memory solutions, according to the company.

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via Yuichun