Imec and GloFo are to join forces to address critical challenges in radio architecture design in multiband, multimode mobile radios and ultra-low power (ULP) wireless devices.
They will cooperate on critical digital-intensive RF architectures and analog circuits for mobile communications and IoT sensor nodes.
Research will leverage GloFo’s CMOS technology platforms optimised to boost RF performance.
A key challenge for next-generation mobile devices is controlling the cost and footprint of the radio and antenna interface circuitry, which contain all of the components that process a cellular signal across the various supported frequency bands.
Today, a typical mobile device must support up to 28 bands for worldwide 2G, 3G, 4G, LTE network connectivity, and more complex carrier aggregation schemes and additional frequency bands are expected for future generations.
These challenges are driving the need for an agile radio that integrates many of the separate components into one piece of silicon, including power amplifiers, antenna switches, and tuners and provides a solution which is both flexible and low cost.
GloFo will closely collaborate with technical experts from Imec to investigate low-power and compact high-performance agile radio solutions that will enable a broad range of radio architecture design–targeting improvements in area, performance and power consumption.
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