Applied Materials improves die-to-wafer and wafer-to-wafer bonding

Applied Materials has announced developments and a partnership for improving heterogeneous chip design and integration. The development is improved software modelling and simulation for die-to-wafer hybrid bonding  – which uses direct copper-to-copper interconnects to increase I/O density and shorten the wiring length between chiplets. This will allow parameters such as material selection and packaging architecture ...

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