Winbond, the Taiwan memory producer, is collaborating with Ambiq, the MCU and real-time clock specialist, to combine Winbond’s HyperRAM and Ambiq’s Apollo4 SoC to deliver system chips for IoT endpoints and wearables. Several customers are in design with Ambiq’s Apollo4 and Winbond 256Mbx8 HyperRAM Hybrid Sleep Mode (HSM), with volume production expected in 2022. HSM ...
This story continues at HyperRAM to be integrated with Apollo4
Or just read more coverage at Electronics Weekly
from News – Electronics Weekly https://ift.tt/3fIfHJe
via Yuichun
沒有留言:
張貼留言