Skywater, the US government trusted fab partner, and MIT have announced that the DARPA Three Dimensional Monolithic System-on-a-Chip (3DSoC) programme, has entered its second phase. After completing the program’s initial phase, focused on transferring the Carbon Nanotube Field Effect Transistor (CNFET)-based 3DSoC technology into SkyWater’s 200 mm production facility, phase two will focus on refining manufacturing ...
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