Yangtze aiming for 8% of NAND output next year

After submitting samples of  TLC and QLC 128-layer NAND to controller chip suppliers in Q1, Yangtze Memory is aiming to start running wafers in Q3 and ramp to mass production in Q4, reports TrendForce. The initial applications being considered for the 128-layer process include UFS-based storage solutions and SSDs; Yangtze also intends to ship packaged ...

This story continues at Yangtze aiming for 8% of NAND output next year

Or just read more coverage at Electronics Weekly

from News – Electronics Weekly https://ift.tt/3bp7qq1
via Yuichun