Ranovus, IBM, TE Connectivity and Senko aim for co-packaged optics in datacentres

Ranovus, IBM, TE Connectivity and Senko are combining to design and manufacture multi-vendor solutions for Co-Packaged Optics applications in data centre.  The collaboration leverages:  Ranovus’ Odin silicon photonics engine (pictured) which incorporates the company’s in multi-wavelength Quantum Dot Laser (QDL), 100Gbps Silicon Photonics based Micro Ring Resonator modulators and photodetectors, 100Gbps Driver, 100Gbps TIA and control ...

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