SEMI billings down 20% y-o-y

Q2 chip manufacturing equipment billings reached $13.3 billion in the second quarter of 2019, down 20% y-o-y same and down 3% from Q1, reports SEMI. The data are gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from more than 80 global equipment companies that provide data on a monthly basis. The quarterly billings ...

This story continues at SEMI billings down 20% y-o-y

Or just read more coverage at Electronics Weekly

from News – Electronics Weekly https://ift.tt/2LscwqZ
via Yuichun