Panasonic has launched a delamination-free semiconductor encapsulation material for semiconductor packages use in automotive and industrial applications. Full-scale production started in January 2019. Panasonic claims it will increase the reliability of automotive ECUs and industrial equipment. Previous semiconductor encapsulation materials, particularly those used in high-temperature environments, are prone to failures caused by interfacial adhesion loss between ...
This story continues at Panasonic launches delamination-free IC encapsulation material
Or just read more coverage at Electronics Weekly
from News – Electronics Weekly http://bit.ly/2HQ8yZE
via Yuichun
沒有留言:
張貼留言