Toshiba has shipped its first 130nm ‘structured array’ asic, and announced this at Electronica today. Read our full Electronica 2018 coverage » Structured asics have a fixed array of logic in the underlying silicon, on to which custom metallisation is applied for each different application. Toshiba brands this ‘FFSA‘ for ‘fit fast structured array’, and ...
This story continues at Electronica: Toshiba offers 130nm asic process for industrial applications
Or just read more coverage at Electronics Weekly
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