Taiwan-based IC packager Xintec is expected to enjoy significant 3D sensing business opportunities from both iPhone and Android-based smartphone camps in 2018 in its capacity as a re-invested affiliate of Taiwan Semiconductor Manufacturing Company (TSMC), due mainly to 3D sensing modules poised to be mass-applied to smartphones of both camps, according to industry sources.
from DIGITIMES: IT news from Asia http://ift.tt/2r9zE5z
via Yuichun
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