Taiwan lead frame maker SDI plans to expand its production capacity by 15% in the first half of 2018 to meet increasing application of lead frame-based QNF (quad flat no-lead) packaging of automotive chips, power semiconductor, and power management modules, with the firm's visibility of orders remaining clear throughout the first half, according to industry sources.
from DIGITIMES: IT news from Asia http://ift.tt/2qSwqTR
via Yuichun
沒有留言:
張貼留言