Infineon has developed a new 3D image sensor in its REAL3 chip family, based on Time-of-flight (ToF) technology. It enables camera modules for integration in smartphones with a footprint of less than 12 mm x 8 mm, including the receiving optics and VCSEL (Vertical-Cavity Surface-Emitting Laser) illumination. Market forecasts expect smartphones with 3D sensing functionality ...
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