China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement in processing techniques and capabilities after its success in 28nm and 14nm wafer bumping mass production in 2016, and indicates the recognition from Qualcomm for the company's comprehensive operation and management capabilities.
from DIGITIMES: IT news from Asia http://ift.tt/2wnLUBq
via Yuichun
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