With the semiconductor-manufacturing industry needing the high computing power that can only be achieved through advanced node logic and memory, as well as the heterogeneous-integration capabilities that require advanced-packaging innovations, Brewer Science has invested in developing specialty materials and processes that support both, from its robust portfolio of temporary bond/debond materials and processes for fan-out packaging and 3D IC manufacturing processes to its EUV and DSA materials for advanced lithography processes.
from DIGITIMES: IT news from Asia http://ift.tt/2h3Q9Yt
via Yuichun
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