2017年8月15日 星期二

Globalfoundries demos 2.5D HBM solution

Globalfoundries has demonstrated silicon functionality of a 2.5D packaging solution for its 14nm FinFET FX-14 integrated design system for application-specific integrated circuits (ASICs).

from DIGITIMES: IT news from Asia http://ift.tt/2vHjMpH
via Yuichun

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