Taiwan Semiconductor Manufacturing Company (TSMC) is planning to carry out the first-ever expansion of its CoWoS (Chip on Wafer on Substrate) packaging and testing capacity to fill increasing orders from Nvidia and Google for AI chips, indicating that Taiwan's semiconductor industry is gradually embracing the new era of deep machine learning and AI applications, according to industry sources.
from DIGITIMES: IT news from Asia http://ift.tt/2uOT3JB
via Yuichun
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