TSMC InFO packaging brings more competitiveness to its 7nm process technology

Taiwan Semiconductor Manufacturing Company's (TSMC) integrated fan-out (InFO) wafer-level packaging technology is about to enter its second generation, which will bring more competitiveness to the foundry's 7nm FinFET process technology, according to industry observers.

from DIGITIMES: IT news from Asia http://ift.tt/2gMcgpx
via Yuichun