Global Unichip has successful taped out a 16nm, second-generation high bandwidth memory (HBM) PHY and controller with verified interposer design and CoWoS package. The ultra-high capacity memory ASIC solution will meet the demanding requirements of artificial intelligence (AI), deep learning (DL), and a variety of high performance computing (HPC) applications.
from DIGITIMES: IT news from Asia http://ift.tt/2sK5V2o
via Yuichun
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