2017年2月16日 星期四

SiP module supplier ShunSin to roll out more fingerprint sensor, telematics modules in 2017

ShunSin Technology, a subsidiary of Foxconn Electronics specializing in assembly and test of system-in-package (SiP) modules, plans to focus more on fingerprint sensor and telematics modules in 2017, according to a Chinese-language udn.com report.

from DIGITIMES: IT news from Asia http://ift.tt/2kVHCdr
via Yuichun

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